EUV Lithography (EUVL) Symposium Presentations
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Cost-effective shrink with Holistic Lithography, extended by EUV
Progress on enabling EUV Lithography for high volume manufacturing
Picosecond, kW thin disc laser technology for LPP and FEL EUV sources
Key components technology update of 100W EUV light source for HVM
A wide band transmission mode spectrometer for diagnosis of EUV sources
Study on defect control of resist process for production ready EUV lithography
Anamorphic High NA Optics enabling EUV Lithography with sub 8nm Resolution
EUV High-NA scanner and mask optimization for sub 8 nm resolution
Current status and outlook of etched multilayer mask for EUV extension
Modeling EUV mask using alternative materials for Mask3D effect compensation
Anamorphic High NA Optics enabling EUV Lithography with sub 8nm Resolution
EUV High-NA scanner and mask optimization for sub 8 nm resolution
Current status and outlook of etched multilayer mask for EUV extension
Modeling EUV mask using alternative materials for Mask3D effect compensation
Metal Containing Material Integration on Coater/Developer System
BENCHMARKING STUDY OF CONTACT HOLES AND LINE AND SPACING IMAGING
Development of a high numerical aperture EUV lithography tool: the Berkeley MET5 Platform
Controlling interface chemistry in 6.x nm La/B multilayer optics
Utra-broadband ptychography with self-consistent coherence estimation from a high harmonic source
Light Sources for High Volume Metrology & Inspection Applications
Compact discharge based EUV source for metrology and inspection
Metrology tools for the characterization of light sources in the spectral region around 6.x nm
EUV SCATTERING METROLOGY WITH HIGH-BRIGHTNESS DISCHARGE PLASMA SOURCE
High stability droplet generator for EUV actinic inspection applications
Temperature distribution of the multi-stack EUV pellicle with various structures and materials
Feasibility study of through pellicle inspection for patterned extreme ultraviolet mask
Thermo-Mechanical Distortion of Extreme-Ultraviolet Pellicle
Feasibility study on inserting graphene layers into EUV pellicle structure
Extending final clean of EUVL reticles to 100X cleaning cycles
Understanding the Effects of Transmittance and Stand-off Distance of EUV Pellicle
Thermomechanical behavior of the EUVL pellicle during the exposure
Multilayer mask roughness: correlation between scatterometry and image-plane speckle
Ultrahigh efficiency contact-hole printing with chromeless phase shift mask
Using the SHARP EUV Microscope’s aerial images to study line edge roughness
Phase Imaging Results of Phase Defect Using the Lensless EUV Microscope
Actinic characterization of EUV Photomasks by EUV Scatterometry
Overlay improvement via large dynamic range scanning probe microscope
Improving Scan Speed and Resolution of AFM for Elucidating Resist Dissolution Dynamics
The Mass-filtered Ion Gauge (MFIG), a traffic light for clean vacuum
Patterning Dependency on High NA Anamorphic Directionality through Contamination study
Recent Progress in Resist Outgas Testing for the New Platform at EIDEC
Comparison of EUV resist outgassing between organic and inorganic materials
Chemometrics study of EUV Resist Materials for Witness Sample Based Resist Outgas Testing
SPECTROSCOPIC EUV REFLECTOMETRY FOR CHARACTERIZATION OF THIN FILMS AND LAYERED STRUCTURES
Interaction of intense picosecond laser pulses with liquid tin droplets
CHARACTERIZATION OF HIGH RESOLUTION ELECTRON BEAM RESISTS UNDER EXTREME ULTRAVIOLET IRRADIATION
Development of new xanthendiol derivative applied to the negative-tone molecular resist for EB/EUVL
Absorption coefficient and Dill parameters of CAR and non-CAR resists at EUV
EUV CHARACTERIS ATION TOOL FOR THE ANALYS IS OF LUMINES CENT MATERIALS
Fundamental understanding of EUV radiation induced chemistry on a molecular level
Investigation of Low Energy Electron Mean Free Path and Energy Delivery in EUV Resists
Interaction of EUV radiation with novel photoresist materials
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Improving the reliability of the resist outgas contamination test
Relationship between resist outgassing and activation energy for EUV and EB
IMPROVING EUV MASK SUBSTRATE AND BLANK CLEANING EFFICIENCY BY OPTIMIZING CLEANING CHEMICALS
2014 International Symposium on Extreme Ultraviolet Lithography October 27-29, Washington, D.C.
Free-electron laser extreme ultraviolet lithography: considerations for high-volume manufacturing
Novel Processing Approaches to Enable EUV Lithography toward High Volume Manufacturing
Design of Atomic Hydrogen Sources for Oxide Reduction and Carbon Elimination from EUV Mirrors
Development of EUV patterned mask inspection technologiesfor the 16 nm - 11 nm half pitch generation
COMPACT DISCHARGE BASED EUV SOURCE FOR METROLOGY AND INSPECTION
ANALYS IS OF LIGHT S OURCE INDUCED CONTAMINATION FILMS BY EXTREME ULTRAVIOLET REFLECTOMETRY
Alternative EUV mask technology for Mask 3D effect compensation
Impact of Resist Parameters on Stochastic EUV Printability Failures
New Source and Imaging Capabilities of the SHARP EUV Mask Microscope
Optical Coherence Tomography for reticle back-side inspection
Differential phase contrast imaging for EUV phase defects inspection: A numerical study
Effect of chemical composition on cleaning durability of EUV mask capping layer
Development of new xanthendiol derivative applied to the negative-tone molecular resist for EB/EUVL
EUV LITHOGRAPHY ON THE MOVE FROM PRE-PRODUCTION TO PRODUCTION
High Power EUV Irradiation Tool (HPEUV) Equipped with LPP Source
Progress in EUV Lithography EUV challenges for the 7nm node in the Mobile Industry
Impact of novel defect reduction hardware on EUV patterning defectivity
EUV SCATTEROMETRY FOR HIGH ACCURACY CHARACTERIZATION OF MASK ROUGHNESS
Development of Microwave Discharged Produced Plasma for EUV source
Analysis of buried interfaces of multilayers through at resonance EUV and XRR reflectivity
Performance Evaluation on New Inspection System with Novel PEM for EUV Pattern Masks
14 nm halfpitch @ < 20 mJ/cm2 IRRESISTIBLE MATERIALS Q4 ’14 Molecular Resist Update
Robotic cleanliness in the TNO Reticle Handling Test Platform
Dual-Wavelength Spectral Purity Filter for EUV Collector Mirrors
Challenges and Opportunities: Sub-10nm Generation Patterning Materials
Role of mask in cost and capability dynamics for sub 14nm patterning
High Resolution approach from EUV sensitive Si Hard Mask for 1X nm generation
EUV Mask Blank Manufacturing Solution Within Reach: Immediate Challenges
Characterization of EUV Mirror Capping Layers with Angle-resolved XPS
METAL OXIDE NANOPARTICLE RESISTS WITH SUBSTITUTED BENZOIC ACID LIGANDS
EUV advanced profiling using scatterometry: sidewall roughness and bottom residue
Investigating Printability of Native Defects on EUV Mask Blanks through Simulations and Experiments
Development of a Large Reflectometer for Large p e EUV Optical Elements
Power Scaling of the Tin LPP Source via an Argon Cusp Plasma
Negative tone imaging with EUV exposure for 1x nm node and beyond
Adding a cusp magnetic field to the EQ-10 Z-pinch metrology source
New deposition facility at RIT for coating large EUVL optics
EUV imaging performance and challenges of 10nm and 7nm node Logic
Detection capability for native defect by the actinic blank inspection
Feasibility test of 193 nm wavelength inspection for extreme ultraviolet mask
LCDU improvement in contact-hole patterns by post treatments
Novel patterning materials research at SEMATECH: current status and future outlook
Defect inspection and characterization on actinic blank inspection tool
Recent advances in Mask Blank Deposition and Defect Reduction
The initial performance data of a LPP-source equipped High Power EUV Irradiation Tool (:HPEUV)
Recent progress in actinic lensless mask imaging tool at PSI
Improving EUV imaging at tighter pitch using a tuned-multilayer mask stack
Surface Characterization of Extreme UV
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Study of Mo/Si multilayer on EUV blanks for high NA exposure tool
A Lithographer’s Look at BEUV Image contrast restrictions on demagnification
Infrared antireflective filtering for 6.x nm multilayer Bragg reflectors
Properties of extreme ultraviolet emission from high-Z plasmas
EUV Laboratory Exposure Tool – cost effective solution for laboratory scale EUV nanopatterning
Defect location accuracy improvement with EUV Actinic Blank Inspection Prototype for 16 nm hp
Impact of incident electron energy on patterned EUV mask inspection
Mask patterning technology development for under 40nm size pattern
Investigation of alternative mask stack as a complement for EUV dose insufficiency
Actinic EUV Metrology Tools for Precise and Accurate Spectral Characterization
Comparison of CD Measurements by EUV Scatterometry and CD-AFM
Development of Micro Coherent EUV Scatterometry Microscope for Phase Defect Characterization
Understanding for Defect Signal Fluctuation in Actinic Blank Inspection
Simulation of Plasma and Motion of Nanoparticles in an Ion Beam Deposition Chamber Using CFD-ACE+
Production of EUV Mask Blanks with Single Digit Killer Defects
Accuracy verification of phase defect printability prediction with various defect shape models
Mask surface roughness effects on EUV lithography performance
Thermal Behavior of Multi-Stack EUV Pellicle by Finite Element Analysis
EUV Resist Process Investigation for Coat-develop Track System
Advances Advancesin EUV Under Layer toward 1Xnm patterning patterning
The effect of EUV resist material composition on RLS trade-off
Development of new negative-tone molecular resists based on 4-alkylphenyl[4]calixarene for EUVL
Study on the resist performances of PMMA with different stereo-regularities by EUV and EB exposures
Feasible Feasible solution solution to control control by topcoat topcoat material material
Cleanability of resist-outgas non-carbon contaminations using hydrogen radical cleaning
Tailoring and Matching Stand-Alone Sources (DPP & LPP) for Actinic EUV Metrology
The Energetiq EQ-10 EUV source for metrology -- Review of recent data
Refurbishment of multilayer EUV optics based on Mo/Si coating
Adhesive-free Zirconium Mesh and ZrB2/Zr Ultrathin Membranes
DSA AS A COMPLEMENTARY TECHNIQUE FOR CONTACT HOLE PATTERNING
ASML NXE:3100 PRE-PRODUCTION EUV SCANNER PERFORMANCE AT IMEC
A YEAR OF NEW MASK DEFECTIVITY INSIGHTS IN IMEC’S EUVL PROGRAM
Challenges and Considerations associated with EUV photomask defectivity and repair
Evaluation of repair methods for native defects on EUV masks
Novel EUV Resist Materials Design for 15 nm Half Pitch and Below
EUV Sensitive Si Hard Mask Materials both for PTI & NTI Process
Advances in Directly Patternable Metal Oxides for EUV Resist
Progress in Negative Tone Organic Resists Based on Epoxide Cross-linking for EUVL
High Ce and Magnetic Mitigation Technology for HVM EUV Source
A Driver CO2 Laser Using Transverse-flow CO2 Laser Amplifiers
Current status of EUV patterned mask inspection tool for hp 16 nmand beyond
Stochastic Effects in Resist Processes of Extreme Ultraviolet Lithography
Inhomogeneity of Resist Film Simulated by Molecular Dynamics
EUV RESIST EVALUATION AND PROCESS OPTIMIZATION TOWARDS NXE:3300
EUV mask imaging system based on the scanning reflective microscopy
Development of EUVL Collector Technologies for Infrared Radiation Suppression
E-Beam Inspection of EUV Mask Defects on Patterned Wafers by Die:Database Methodology
Correlation depth analysis of surface roughness by actinic blank inspection
Study of the relation among Resist components, Outgassing species and Contamination
The best approach for Outgassing and OoB issue by EUV Top Coat
Resist outgassing characterization of PAG-blended and PAG-bound systems
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High efficiency transmission masks for EUV interference lithography
Wafer Inspection for Monitoring Particles Added to Reticles During Exposure
The impact of EUV mask residual-type defect thickness on wafer printability
New Test Vehicle with a Variety of Programmed ML Defects for EUV Blanks Inspection
Projection electron microscopic image simulation for EUV mask pattern inspection
Nanoparticle detection limits of TNO’s Rapid Nano: modeling and experimental results
Impact of an etched EUV mask Black Border on imaging and overlay
Simulation of mask “black border” effect in EUV using rigorous models
2012 International Symposium on Extreme Ultraviolet Lithography
Etched multilayer mask in EUV lithography for 22nm node and below
Advances in Mask Blank Defect Characterization for EUV Lithography
Improvements of Multi-Layer Defect Mapping with Advanced Inspection Technology
Experience and progress with polychromatic EUV reflectometers and spectrophotometers
Flexible EUV and XUV Spectrophotometer for reflection, transmission and absorption metrology
Demonstration of fast wide angle scatterometry for CD metrologyusing laboratory DPP-XUV source
Oxidation durability of the Mo/Si multilayer with an oxide capping layer
Characterization of layered surface structures using EUV and soft X-ray radiation
The Characterization of the Witness Sample testing for the Outgassing Qualification of EUV Resists
High line density free-standing transmission gratings for EUV and VUV emission spectroscopy
Influence of the out-of-band light absorption on temperature increase of a pellicle in EUVL
Fabrication of Adaptive Mirrors for Extreme Ultraviolet Lithography
Nanoscale Multilayer Membranes as Optical Elements for EUVL\
Scalability of EUV interference lithography to sub-10 nm half pitch
Analysis of acid-generating action of PAG in an EUV resist using acid-sensitive dyes
Development of New Negative-tone Molecular Resists Based on Phenylcalix[4] resorcinarene for EUVL
Block copolymer mediated healing of the LER of a patterned EUVL resist
Chemically Amplified EUV Resist and Materials Development for 22 nm Half Pitch and Beyond
Prediction of Resist Sensitivity for Extreme Ultraviolet Lithography at 6.x nm Wavelength
RECENT DEVELOPMENTS IN CONSTRUCTION OF RESIST TESTING TOOLS FOR THE NXE PLATFORM
Theoretical Study of Deprotonation of Polymer Radical Cation for EUV Resist
Optimization of EUV resists under the limitation of outgas specification
Ultrathin EUV Underlayer Materials: Stability, Coating Uniformity, Defect, and Resist Performance
Laser Produced Plasma EUV Source Development for Mass Production of sub-20nm Devices
New capability at NIST for reflectivity measurements of large EUVL optics
A Proposal for an EUV light source using transverse flow CO2 lasers
Cap layer selection for the collector mirror in tin LPP sources
Progress on Laser Assisted Discharge Produced Plasma (LDP) EUV Light Source Technology
Rigorous Modeling and Optimization of Multilayer Defect Repair
EUVL Mask Blank Defect Inspection Capability Improvement and its Application at SEMATECH
The SEMATECH Berkeley MET: 2D patterning at 20 nm HP and progress towards 0.5-NA
Progress and remaining challenges of EUV lithography for memory IC manufacturing
Understanding the Patterning Mechanism of Inorganic Nanoparticle Photoresists from HfO2 and ZrO2
LPP EUV Source Performance and Prospects for NGL in Mass Production of sub-20nm Devices
ASML NXE:3100 PRE-PRODUCTION EUV SCANNER PERFORMANCE AT IMEC
EUV Mask Challenges, Status, and Closing the Remaining Technology Gaps
Enhancing Resolution of the Albany Alpha-Demo Tool (ADT) with Pupil Filtering
EUVL mask blank requirements toward high volume manufacturing
Multilayer coatings for the lithography generation beyond EUVL
PROGRESS IN UNDERSTANDING EUV RESIST RELATED OUTGASSING AND CONTAMINATION
Extending Patterning Capability Using Directed Self‐Assembly
Reduction of LWR by Advanced Polymer bound PAG based EUV resist
15NM HALF-PITCH PATTERNING: EUV + SELF-ALIGNED DOUBLE PATTERNING
ULE® Glass with Improved Thermal Properties for EUVL Masks and Projection Optics Substrates
Novel EUV Resist Materials and Process for 16 nm Half Pitch and Beyond
Level-specific material evaluations for NXE3300 applications
ASSESSMENT OF EUV RESIST PERFORMANCE FOR SUB-22NM HP LINES AND 26NM HP CONTACTS ON NXE3100
Progress on Laser Assisted Discharge Produced Plasma (LDP) EUV Light Source Technology
In-situ optical testing of exposure tools via localized wavefront curvature sensing
New approach for reducing the Out of Band effect and outgassing by applying top coat materials
Material- and polishing-induced defectivity on EUV mask substrates
Characterization of NXE3100 in view of 1Xnm node DRAM patterning
EUV enables single exposure 14nm node First NXE:3300B exposures at ASML
Enhanced lifetime and optical performance of the NXE:3100 LPP collector mirrors
A Comparison of Positive- and Negative-tone Contact Hole Process Flows Using the IMEC NXE:3100
Opportunity to extend EUV lithography to a shorter wavelength
Multilayer-based solutions for suppression of IR radiation in EUV systems
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SEMATECH Approach to Smoothing Pit Defects on EUV Mask Blank Substrates
Defect-Free LTEM Substrates for EUV Lithography: Challenges and Solutions
Substrate Roughness and LER investigated by EUV Scatterometry
Reflective multilayer coatings, an enabling component of Extreme Ultraviolet Lithography
Study of New Phase Shift Mask for the Reduction of Shadow Effect in 16 nm Node
Compact and efficient atomic hydrogen cleaner for resist qualification
Particle Contamination in EUVL: Estimations on the Critical Particle Sizes
Development of Novel positive-tone resists for EUVL- Improvement of film strength
Short-Range Proximity Effect Correction for EUV Mask Writing
The factor affecting on LWR & Sensitivity in EUV resist material
Chemical Analysis of Ultra-Thin Films: Understanding Chemical Changes as a Result of EUV Irradiation
EUV Outgassing and Contamination in Multilayer Material Schemes
Integration of Stand-Alone Coherent Scattering Microscope with Femto Second Laser based EUV Source
Failure analysis and defect characterization for EUV mask blanks
Post-Process Effects on Line End Shortening and Image Distortion
Brilliance Scaling of Discharge based EUV Sources for Metrology
Development of Chemically Amplified EUV resist for 22 nm half pitch and beyond
Theoretical evaluation of polymer bound photoacid generators for EUV resist
Impact of Underlayer (UL) Properties for Lithographic Performance in EUVL
RECENT RESULTS FROM OUR AUTOMATED REFLECTOMETER FOR MEASUREMENT OF REFLECTIVITY OF EUV LITHOGRAPHY MASKS
BLANKS AND ABSORBERS. PLANS FOR DEVELOPING A REFLECTOMETER TO MEET THE HVM REQUIREMENTS
Overlay control study mitigating wafer leveling/clamping effect on Alpha Demo Tool
Line Width Roughness Control on Resist Process for EUV Patterning
Cleaning performance evaluation of EUV mask blanks using Lasertec M7360
High-sensitivity EUV resists based on Tetrafluoroethylene contained Fluoropolymers
Phase defect detection and analysis using actinic blank inspection tool and TEM
Evaluation of resists for sub-22 nm hp patterning using EUV interference lithography
2011 International Symposium on Extreme Ultraviolet Lithography October 17-19 Miami, FL
Mechanisms of EUV reflectivity loss from the multiple cleanings
STOCHASTIC LIMITATIONS FOR EUV RESIST KINETICS TOWARDS THE 16 nm NODE
Requirements and Challenges of EUV mask inspection for 22nm HP and beyond
LER Limitations of Thin EUV Resists: Mechanistic Study into Root Causes
SEMATECH's Perspective on EUV Mask Blank Status and Manufacturing Infrastructure
Readiness and requirements of EUVL mask blank in each hp node
Latest Results from the SEMATECH Berkeley Actinic Inspection Tool
Wavelength selection for multilayer coatings for the next generation EUV lithography
Optimization of Low Diffusion EUV Resist on Different Substrates
Evaluation of Aberration Controllability of the Full-Field Exposure System
Enhancement of Resist Performance by Proton Source Unit on Polymer Bound PAG Platform
Full Wafer Imaging Budget Verification and Litho Performance Optimization
Experimental validation of full-field compensation for EUV flare and mask shadowing
Grazing Incidence Collectors for both DPP and LPP EUV Lithography
Characterization and detailed understanding of the EUV mask blank deposition process
The Novel Spin-on Hard Mask and Ultra thin UL material for EUVL.
EUV lithography: NXE:3100 is in use at customer sites and building of NXE:3300B has started
Wavelength Dependence of EUV- Induced Optics Contamination Rates
Viability of e-beam mask inspection solution for EUV in production environment
High Brightness Electrodeless Z-PinchTM EUV Source for Mask Inspection Tools
Wavelength Dependence of Lithography Resolution in Extreme Ultraviolet Region
Defect detection sensitivity improvement of actinic blank inspection
EUV Lithography for High-Volume Manufacturing Progress and Challenges
Solutions with light –meet challenges and offer opportunities
Preserving Printed Wafer CD Stability in High-Frequency EUVL Mask Cleaning
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Opportunities for optimizing vacuum and abatement systems for Extreme Ultra Violet Lithography
Feasibility study of EUV lithography for 2x-nm node using electrical test chip
Integration Related Issues of EUV Patterning for D3X with ADT
The SEMATECH Berkeley MET: Bridging the Gap to 16-nm Half-Pitch Development
EUV Enabling Research and Development at the College of Nanoscale Science and Engineering
Demonstration of CDU and LWR Performance Improvement Techniques on a Full-Field EUV Exposure Tool
Resolution capability of SFET with slit and dipole illumination
Improvement for Operating SFET Light Source and Collector module
Dependence of lithographic performance on light-shield border structure of EUV mask
Printability and Inspectability of Programmed and Real Defects on the Reticle in EUV Lithography
Arial images phase measurement with the AIT: a new dimension in mask metrology
Substrate, Blank and Mask Cleaning Contribution to EUV Mask Defectivity and Lifetime
Low defect EUVL mask blank deposition tool process characterization and modeling
Modeling growth of defects during multilayer deposition of EUV blanks by level set method
Influence of Pellicle on 22 nm Pattern in Extreme Ultra-Violet Lithography
Overlay accuracy of EUV1 using compensation method for nonflatness of mask
The suggestion of novel attenuated phase shift mask structure in Extreme Ultraviolet Lithography
Reflective multi-layer etching for repairing clear defect on EUV masks using FIB
18X surface cleaning impact on process performance of an EUV mask
Extreme ultraviolet mask substrate phase surface roughness effects on lithographic patterning
3D measurement SEM for EUV mask pattern quality assurance based on lithography simulation
The study on influence of carbon contamination on imaging performance of EUV mask using CSM/ICS
The influence of LER and LWR on angular resolved EUV scatterometry
High-Precision Wavefront Metrology Using Low Brightness EUV Source
Wavefront Evaluation for 6-mirror Projection Optic with EUV Wavefront Metrology System
Accurate calibration of reflectometers using a standard multilayer mirror
Dependence of contamination rates on key parameters in EUV optics
New NIST high intensity beamline for direct testing of optics carbonization from irradiated resists
Interaction of benzene and toluene vapors with Ru(0001) surface
A simple modeling of carbon contamination on EUV exposure tools
Development of low-pressure UV cleaning technique for carbon contaminated EUV optics
EUV optics cleanliness qualification using spectroscopic ellipsometry
Contamination experiment for EUVL optics mirrors with the use of single bunch SR
Cleaning of Silicon- Silicon-Containing Carbon Contamination
Carbon and particle removal from EUV reticles by shielded microwave induced remote plasma
DEVELOPMENT OF EUV PELLICLE WITH SINGLE CRYSTAL SILICON MEMBRANE
EUV resist material performance, progress and process improvements at imec
Assessment and extendibility of chemically amplified resists for extreme ultraviolet lithography
Understanding RLS limitations for EUV pre-production stages: “Impact of resist dissolution”
Understanding Underlayer Physical Properties and their Effect on EUV Resists
EUV process sensitivities and optimizations for wafer track processing
Correlation of EUV Optics Contamination and the Photoresist Chemistry
Mechanism of Pattern Collapse Improvement using TBAH Development
Poly(olefin sulfone)s - A Materials Platform for Studying Resist Derived Contamination
Development of EUV resists based on low-molecular-weight materials
Characterization of EUV Resist Dissolution using In situ Analysis
Alternative rinse solutions and after-development-rinse processes for EUVL
EUV Lithography for 22nm Half Pitch and Beyond: Exploring Resolution, LWR, and Sensitivity Tradeoffs
EUV Contact Hole Resist Progress for High Photosensitivity and Improved Local CD uniformity
Investigation of reactivity of photoacid generators for EUV exposure
EUV Negative Resiste Using Thiol-Yne Stepwise Radical Reaction
Evaluation of Resist Performance for 22nm Half-Pitch and Beyond Using EUV Interference Lithography
Resist Evaluation by EUV Interference Lithography for 22 nm Node and Below
Characteristic of main chain decomposable STAR shaped polymer for EUV resist
Development of Chemically Amplified EUV resist for 22 nm half pich and beyond
Studies of Acid Diffusion of Anionic or Cationic Polymer Bound PAG
Development of positive-tone molecular resist based on Phenyl[4]calixarene for EUVL
Study of High Adhesion Under Layer material for EUV Lithography
NEXT GENERATION EUV RESIST OUTGASSING AND RETICLE CONTAMINATION TOOL MODEL NO. RER-300-PEX
High Brightness EUV Light Source Applications using Diffractive Optics
COMPARISON BETWEEN EXISTING INSPECTION TECHNIQUES FOR EUV MASK DEFECTS
Proof of concept for LPP based high brightness EUV source for actinic mask metrology
Improvement in actinic blank inspection and characterization of phase defects
EUV Actinic Mask Imaging with the SEMATECH Berkeley Actinic Inspection Tool (AIT)
Study of the phase defect with minimum width and depth affecting the exposure result
EUVL Mask Blank Defect Inspection Capability at SEMATECH Capability at SEMATECH
Study of EUV Mask Defect Inspection and Repair Using Conventional Tools and Techniques
Inspection solutions for EUV-mask defectivity applications For 22nm EUV
EUV mask absorber pattern inspection using DUV inspection tool
XTREME Technologies First Tin Beta SoCoMo ready for Wafer Exposure
1st generation Laser-Produced Plasma 100W source system for HVM EUV lithography
DLC/Si multilayer mirrors with IR antireflective properties at 10.6 μm
Laser-produced Sn microplasma for EUV metrology light source
Laser-produced plasma EUV source around 6.7-6.8 nm for future semiconductor lithography
Radiation Hydrodynamic Simulation of Laser-produced Tin Plasmas
Sn film and ignition control for performance enhancement of laser-triggered DPP source
Improvements in pulse-to-pulse stability to the EQ-10 Electrodeless Z-Pinch EUV Source
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Towards High-Volume Manufacturing of Logic Devices Using EUV Lithography
EUV Lithography – Status and Key Challenges for HVM Implementation
Backside Feature Transfer during Electrostatic Chucking of Masks*
EUV Resist Contrast Loss Determination Using Interference Lithography
Optical element for full spectral purity from IR-generated EUV light sources
Highly Sensitive Non-Chemically Amplified Negative Resist for EUVL
TROITSK INSTITUTE FOR INNOVATION & FUSION RESEARCH (SRC RF (SRC RF TRINITI)
Thermal stability and lifetime scaling of multilayer EUVL optics
Development of Chemically Amplified EUV Resist Suitable for Ultra-Thin Layer Patterning
Development Of Non-chemically Amplified Photoresists for Extreme Ultraviolet (EUV) Lithography
REALIZATION OF EUV PELLICLE WITH SINGLE CRYSTAL SILICON MEMBRANE
Reflectometry for full-size EUV collector mirrors for high power LPP sources
Stabilization of IF characteristics by automatic alignment system for collector module alignment
Performance Status of EUV Resist; 24nm HP CNT at MET, and 27nm HP PWA at ADT1
EUV RLS Performance Tradeoffs for a Polymer Bound PAG Resist Process
Study of EUV Pinch Dynamics and Overcoming Collector and Mask Issues
EUV mask pattern defect inspection using 199-nm inspection optics
Main chain decomposable STAR shaped polymer for EUV lithography
Defect printability of thin absorber mask in EUV lithography with refined LER resist
Novel Ozone-based Cleaning Technique for EUV Masks and Optics Carbon Contamination
Polycarbonate Based Non-chemically Amplified Photoresists for Extreme Ultraviolet Lithography
Status of ETH Zurich’s Tin Droplet Dispenser for LPP Sources
3D measurement of ion, neutral debris and EUV radiation distribution
In situ monitoring of mimicked carbon contamination of EUV optics by spectroscopic ellipsometry
Pattern Shape Dependency of Mask Shadowing Effect and it's correction
EUV Underlayer to Enhance Photospeed and Prevent Pattern Collapse
Interaction of selected MET tool residual gas hydrocarbons with the Ru(10-10) surface
Radiation Hydrodynamic Simulation of Laser-produced Tin Plasmas
Electron Electron-induced in EUV Resist Activation induced in EUV Resist Activation
Complex investigation of Mo/Si multilayer optics after exposure to pulsed EUV radiation
Latent Image Created using Selete Small-Field Exposure Tool for Extreme Ultraviolet Lithography
Patterning Dependency on Extreme Ultra Violet Wavelength and Bandwidth
Influence of Surface Roughness on 22 nm Node Extreme Ultra-Violet Lithography
Improvement of imaging properties by optimizing the mask structure using phase shift effect
EUVL Image Placement Error Analysis with a Rotatable Reticle
Determining Critical Defect Size for EUV Mask Substrates and Blanks
Plasma Cleaning of Carbon and Nanoparticles From EUV Materials
High Brightness NGL Multiplexed EUV Light Source for EUV Interferometer, Metrology & Inspection
Developments on EUV-reflectometry for high volume manufacturing of EUV-masks
Density profiles of photoresist thin films by high precision x-ray reflectivity analysis
PRODUCTION OF HIGH-PURITY FUNCTIONAL WATER AT POINT-OF-USE FOR ADVANCED MASK CLEANING PROCESSES
Experiments on defect inspection of mask blanks with an EUV microscope
Simulation of defect scattering efficiency on multilayer mirrors for EUV mask inspection tool
Correlating Resist Photospeed using Various Exposure Platforms
Feasibility study of EUVL for high volume production applying an electrical test chip
Applicability of device fabrication for hp-35-nm wiring with extreme ultraviolet lithography
Accurate Models for EUV Simulation and Their Use for Design Correction
Next Step for Beyond 22nm Node Application Using Full Field Exposure Tool
How good will EUV masks need to be to meet LER requirements?
Implementing E-beam Correction Strategies for Compensation of EUVL Mask Non-flatness
Investigation of Mask Defect Density in Full-Field EUV Lithography
Strategy and Feasibility of Defect-free Mask Fabrication to Enable EUVL
Development of Mask Contamination/Inspection System by coherent EUV light
Actinic imaging of known native defects on a full-field mask
A Study of Real Native Defects on EUV Mask Blanks Using a DUV Blank Inspection Tool and SEMATECH AIT
Using a 193-nm inspection tool for multi-layer mask blank inspection
Experimental Determination and Accurate Modeling of the EUV ADT flare
Resolution, LWR, and sensitivity improvement on polymer-based resist materials
Acid Amplifiers Designed For EUV Resists Can Help Beat the RLS Trade-off
Using the 0.3-NA SEMATECH Berkeley MET for sub-22 nm half pitch development
Non-Traditional Molecular Resist Designs: Cationic Polymerization
Characterization of EUV resist related outgassing and contamination
Monitoring EUV Reticle Molecular Contamination on ASML’s Alpha Demo Tool
Observation of carbon contamination growth on SFET exposed mask, and its modeling and its modeling
Dynamic scan operation of actinic EUVL mask blank inspection system with TDI mode
PROGRESS IN ACTINIC MASK IMAGING: The closest look at lines, defects, and phase roughness
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2008 International EUVL Symposium Program Logistics & Overview
2008 EUVL Symposium- Closing Address Lake Tahoe, October 1, 2008
The Comprehensive Cost for the Mainstream NGL and Simplified Extreme Ultraviolet Lithography Method
Strategy for Minimizing EUV Optics Contamination During Exposure
Effective Debris Detection, Mitigation and Cleaning Methods for Source - Collector Optics
Carbon accumulation on model MLM cap layer: Interaction of benzene vapor with TiO 2 surface
Progress on EUV reticle dual pod carriers for use in the fab and exposure tools
A study of optical inspection on EUVL mask for 32 nm half pitch node device and beyond
EUV Alpha Demo Tools – Stepping stones towards volume production
Lithographic performance of Selete's full field EUV exposure tool
Full-field Patterning Test with ADT for 30-nm node Device Application
Ultra-high resolution extreme ultraviolet lithography by incoherent to coherent conversion
First Italian EUV micro exposure tool at 14.4 nm based on Kr DMS
Multiple Catadioptric Simplified Extreme Ultraviolet Whole Lithography Machine and System
Composite Double Reflection Simplified Extreme Ultraviolet Whole Lithography Machine and System
An Overview An Overview of a Development Program of a for EUVL Mask Technologies in Selete
Multilayer Defect Compensation to Enable Quality Masks to Enable Quality Masks for EUVL Production
Applying Thinner Absorber to the EUVL Mask: EUV printability and integration issues
Experimental Study on Flatness of Electrostatically Chucked Reticle
Investigation of a Compensation Method for Pattern Placement Shifts of Chucked EUVL Masks
Characterization of EUV Mask Defects: Printability and Repair Process
Mask defect printability in Full Field EUV Lithography – Part 2
Development of actinic mask blank inspection technology at Selete
EUVL Blank Defect Inspection EUVL Blank Defect Inspection Capability at Intel Capability at Intel
Analysis of Sub-22-nm Aerial Image Using Coherent Scattering Microscopy
Iterative procedure for in-situ optical testing using an incoherent source
Resist Outgassing Measurements and Calibrations for High Volume Manufacturing
Experiment of contamination generation by EUV irradiation with the use of high-mass hydrocarbon gas
EUVL Optics Contamination from Resist Outgassing; Status Overview
Experimental Study of Particle-free mask free mask handling techniques using the MPE tool
Advances in resist testing at PSI EUV-IL exposure tool IL exposure tool
Positive and Negative Tone Molecular Resists for 22-nm node EUVL Patterning
Development of new negative-tone molecular resists based on alkylphenyl calixarene for EUVL
Survey and comparison of deprotection blur metrics for extreme ultraviolet photoresists
Investigation of CA resist decomposition by EUV and EB exposure
Novel Polyphenol Base Molecular Resist Having High Thermal Resistance
DUV source integration into the 0.3 NA Berkeley SEMATECH MET for OOB exposure studies
Relation between Acid Diffusion and Resolution in Chemically Amplified EUV Resists
EUV resist outgassing quantification and qualification analysis methods
Development of Partially Fluorinated EUV Resist Polymers for Sensitivity Improvement
Corner rounding in photoresists for extreme ultraviolet lithography
2008 European EUVL EUV activities the EUVL shop future plans
Time-multiplexed solid-state laser-driven EUV sources for Beta-tools and HVM
EUV Spectrometers for Source Development, Characterization and Optimization
The Characterization of the Ion Beam from a Sn-based DPP with Respect to the Ignition Parameters
Guidelines and Promising Approach for LPP-EUV Light Source for HVM
DESIGN AND FABRICATION CONSIDERATIONS OF EUVL COLLECTORS FOR HVM
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Reflectivity improvements and cleaning possibilities of TiO2- and RuO2 – capped multilayer mirrors
Sn contamination removal from mirror samples exposed to a Sn EUV source
Debris mitigation and mirror cleaning for Sn-fueled EUV source
3D PIC simulation for B-field shield of field shield of ion debris in LPP-EUV source
EUV-induced reflectivity loss of capped multilayer mirrors in various vacuum environments
Resonances in Secondary Electron Yields from y Electron Yields from Capped Multilayer Mirrors
Radiation-induced defect formation and reactivity on model TiO2 capping layers with MMA
Contamination Control in the Projection Optics Box – part II
Characteristics of additional carbon on the surface of carbon on the surface of carbon capping layer
Surface Properties of EUVL Mask Layers after High Energy Laser Shock Cleaning (LSC)
Status and Gaps of Status and Gaps of EUV Mask Pattern Inspection Using DUV Light
Evaluation of EUV Mask Repair Methods for Si-capping & Ru-capping Blanks
Optics design and performance analysis of actinic EUV mask blank inspection with dark-field imaging
Study on critical dimension of printable phase defects using an EUV Microscope
Evaluation of EUVL mask pattern defect inspection using 199nm inspection optics
EUV Mask flatness compensation in writing and exposure tools relating to total overlay
Growth and Printability of Growth and Printability of Multilayer Phase Defects on EUV Mask Blanks
Current Status of a Development Program for EUVL Mask Technologies in Selete
Commercial EUV mask blank readiness for 32 nm HP 2013 requirements
Development of EUV mask substrates Development of EUV mask substrates with low thermal expansion
Compensating for Image Placement Errors during the Fabrication during the Fabrication of EUVL Masks
Impact of mask absorber properties on printability in EUV lithography
Study on hole pattern printability of thin absorber mask in EUVL
Evaluation of EUV mask pattern inspection using DUV reticle inspection tool
Evaluation of EUV scatterometry for CD characterization of EUV masks using rigorous FEM Simulation
Assessment of CD and pattern position error caused by non-flat surface of mask and chuck
Optical and Physical Characteristics of EUV Phase Shift Masks
Study of capping layer impact on reflectivity loss by carbon deposition
Development status of EUV wavefront Development status of EUV wavefront metrology system (EWMS)
EUV metrology tools for position sensitive detection and broadband spectroscopy
EUV Mask Reflectometry: Aspects influencing Accuracy, Precision and Stability
Development of Coherent EUV Scattering Microscopy For the Inspection of EUV Mask Patterns
Radiation Damage of an EUV Mirror Cap Layer Modeled by Electron Irradiation of TiO 2(011)-2x1.
Spin-on-glass smoothing of diamond-turned fly-eye illumination mirrors
Evaluation of surface roughness of ULE substrates machined by Ar+ ion beam
Impact of 3-D Mask Effects on Process Windows in Extreme Ultraviolet Lithography
Aberration budget based on Zernike sensitivity for EUV lithography
Photons, Electrons and Acid Yields in EUV Photoresists: A Progress Report
Effect of Fluorine Atom on Acid Generation in Chemically Amplified EUV Resist
Performance Assessment of Novel Resist Approaches using a single Figure of Merit
EUV Resist Outgassing Testing Based on Contamination of Mo/Si Witness Plates
Imaging Capability of EUV Photoresists: Contact Holes, Lines and Spaces
Quantum Yield, Contrast Curves, and Optical Density of EUV and 193i Photoresists
Effects of activation energy for deprotection reaction on latent image contrast
A linear systems approach to advanced EUV resist characterization
Limitation of the Acid Diffusion Length in Extreme Ultraviolet Lithography
Study on De-protection Reaction Analysis System for EUV Lithography
Outgassing study of resist for extreme ultraviolet lithography at PAL
Novel Anionic Photoacid Generators and Corresponding PAG Bound Polymeric Resists
Comparison of Resolution, LWR, Exposure-latitude in EUV advanced resists
Development of Partially Fluorinated EUV Resist Polymers for LER and Sensitivity Improvement
Performance of high-speed-negative-tone molecular resist for EUV lithography
Core-shell type hyperbranched polymer-based chemically amplified resists for EUV lithography
Rational Design and Synthesis of High Sensitivity Polymeric EUV Resists
Progress and Challenge in Achieving Defect-Free EUV Reticle Handling
Analytical Model to Estimate Diffusional Nanoparticle Contamination on EUVL Photomasks
Development of Particle-free Mask Handling Techniques using MPE Tool
Study of Impact of Particles between EUV Reticle and Electrostatic Chuck
Further Improvement of CE up to 6- 8% and B-field Mitigation of Fast Ions
Minimization of debris and out-of-band light emanation with laser-produced minimum-mass Sn plasma
Lessons learnt on Sn DPP sources in Alpha tool and the road to HVM
Development of Xe and Sn Discharge Produced Plasma Light Source for EUV Lithography
Characterization of ionic debris emitted from a Sn-based DPP EUV-source
EUV Emission, Fast Particles and Debris Generation in Transient Plasmas of DPP and LPP Sources
180 W Source Power Candidates other than metallic tin in view of atomic Process
In-Band and Out-of-Band Emissions from Charge-Selected Sn Ions
Simple Analytical Model for Efficient Conversion of LPP-EUV and Ion Spectrum of Debris
EUV and Debris Characteristics of a Tin-Oxide Nano-Particle Colloidal Jet Target
Experimental study of the out-of-band emission from laser produced Sn plasma
Low-density and nanostructured tin as high CE LPP targets and their high repletion study
Fundamental study of punch-out target system for extreme ultra violet (EUV) light source
Performance of Forced Recombination Lithium Target driven by Nd:YAG Laser
Debris characteristics of EUV plasma sources produced continuously by a pulse Nd:YAG laser
Generation of a Mass-Limited Tin Micro-Droplet using Pulsed Laser for EUV Light Sources
Emission characteristics of debris from Nd:YAG LPP and CO 2 LPP
Angle-resolved spectroscopic studies of tin laser-produced plasmas from 10 – 18 nm.
Characterization of a laser produced Sn plasma and debris mitigation
High Peak and Average Power LD Pumped Nd:YAG Rod Laser System for EUV Generation
High Power 13.5 nm EUV Generation Using a High Power 13.5 nm EUV Generation Using a Fiber Laser
XUV spectroscopy of mass-limited Sn-doped laser micro-plasmas
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Contamination Cleaning of Ru-capped EUV Multilayer-Mirror with Atomic-Hydrogen
Essential procedures for endurance testing of multi-layer mirrors
Radiation Radiation-induced processes on induced processes on Ru surfaces: relevance to EUVL
Comparison of actinic and non-actinic inspection of programmed defect masks
State of the art EUV mask blank inspection with a Lasertec M7360 at the SEMATECH MBDC
Baselining the performance of a EUVL full field scanner through rigorous modeling
Smoothing EUVL mask substrate defects with an emphasis on real-world pits
Challenges of Removing 30nm Particles in EUV Mask Blank Cleaning
Removal of Nano Particles on EUV Mask Buffer and Absorber Layers by Laser Shockwave Cleaning
Impact of 3-D Mask Effects on CD and Overlay over Image Field in Extreme Ultraviolet Lithography
Accuracy of the ASET Dilatometer for Low Thermal Expansion Materials
Line Edge Roughness and Cross Sectional Characterization of Sub-50 nm Structures using CD-SAXS
The Design of Chemically Amplified Resist for EUV lithography
Status and Path to Particle-Free EUV Reticle Protection and Handling
Collector Optics Integration Into Medium Power EUV Source Systems
EUV resist material study for the outgassing reduction and LWR improvement
Improved EUV Resist Performance through Processing Refinements
EUV Resist Performance under High Stray Light Levels: an Interference Lithography Study
Extending the lifetime of collector optics: advanced debris mitigation schemes and cleaning methods
High power EUV source development for beta level and high volume manufacturing lithography
The Philips Extreme UV Sn Source: Recent progress in power, lifetime and collector lifetime
Development of high-power Sn-fueled DPP EUV source for enabling HVM
Development Status of HVM Laser Produced Plasma EUV Light Source
Summary of Japanese Academic Support Program for LPP EUV Source
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Progress in optics lifetime program for ASML for EUV lithographic tools
Trends in the Cost of Photolithography Development and an Outlook for the Future
Characterization of Actinic Mask Blank Inspection for Improving Sensitivity
New technique for EUV mask Defect mitigation : “Reversal Technology”
Influence of Particle Contamination on EUVL Reticle Distortion During Exposure Chucking
Optimization of Absorber stack of EUVL mask in optical and etch properties
RIM-13: A high 13: A high-resolution imaging tool for aerial image monitoring of EUV reticles
Systematic error evaluation of EUV wavefront metrology system
Sub-40 nm spatial resolution imaging with 13.2 nm wavelength illumination from a table-top laser
Generation of optical systems for lithography via saddle points
Point Diffraction Interferometer for Testing EUVL Projection Optics
Novel Method for Fabrication of High Efficiency Diffractive Optics for Extreme Ultraviolet
Integration of Self Integration of Self-Assembling Resist Materials into the Lithographic Process
Beneficial Photoacid Generator for Chemically Amplified Resist in EUVL
Progress in particle-free handling of reticles in the ASML EUV program
Modeling of Protection Schemes for EUVL Masks under Low Pressure Conditions
High Conversion to 13.5 nm EUV and Debris Mitigation with Mass-limited Plasmas Generated with Laser
CHARACTERISTICS OF ION EMISSION FROM CO2/Nd:YAG LPP WITH TIN TARGET
Characteristics of a EUV Emission Using Mass-Limited Targets Supplied with a Novel Method
Time-Resolved Study of Dense Plasma Focus for EUV Generation
EUV Source Developments on Laser-Produced Plasmas using Lithium New Scheme Target
Studies on laser-produced plasma EUV generation by using fast-supplying cryogenic Xe targets
Progress in LPP EUV Source Development by Japan MEXT Project
KrF laser driven Xenon plasma light source of a small field exposure tool (SFET)
Dynamics of Neutral Debris from Laser-Produced Tin Plasma Studied by Laser-Spectroscopic Imaging
Development of a CO2 Laser Produced Xenon Plasma for EUV Lithography
Theoretical Modeling and Optimization of LPP EUV Light Source
Suppression of Debris with punch-out target and Debris Mitigation by Magnetic Field
Target Fabrication of low-density and nanostructured laser targets to generate EUV
Mitigation of debris emitted by plasma sources: theoretical and experimental results at ENEA
CHARGE EXCHANGE SPECTROSCOPY OF IONS COMPOSED EUV LIGHT SOURCE PLASMAS
Fourth International Extreme Ultra Violet Lithography (EUVL) Symposium
Predicting the Flatness of an EUV Mask after Electrostatic Chucking
Impact of Multi-Layer Deposition Method on Performance and Defects for EUVL Mo/Si Multi-Layers
Low Thermal Expansion material “CLEARCERAM CLEARCERAM®-Z” for EUVL components application
Table-top EUV reflectometer for advanced mirror characterization
Development of a Fizeau interferometer for measuring free form flatness
Applications of Chemical Force Microscopy in EUV Lithography
High-temperature multilayer coating of source collector mirror
THERMAL STABILITY OF MO/SI MULTILAYERS WITH RUTHENIUM INTER-LAYERS.
Multilayer optics with spectral purity enhancing layers for the EUV wavelength range
Performance Characterization of the EUV optical imaging module of the Reticle Imaging Microscope
Multilayer coatings for the 1st EUVL Process Development Tool
EUV Resist Materials Based on Molecular Glass Resist and Non-PFOS Photoacid Generators
Characterization of RESIST LER in the Patterns Replicated in HiNA-3
Modification of Z-pinch Plasmas with External Axial Magnetic Fields Magnetic Fields - II
Development of 20kHz Pulsed Power Generator to Drive Z-pinch Plasmas
Development of Efficient Fiber laser-produced Plasma Source for EUV Radiation
Development of high repetition rate and high power DPP EUV source
Characteristics of Emission Lines from Xe, Sn, and Other Species at EUV Region
Impact Ionization and Excitation of Multicharged Ions in DPP & LPP
A Black-box Modeling Engine for Optimization Modeling of EUV Plasma Sources
The Strongly Multiplexed The Strongly Multiplexed Micro Plasma Pulse EUV Source Concept
Optimization of EUV Lithography Plasma Radiation Source Characteristics Using HELIOS-CR
EUV emission from a laser-produced tin plasma by use of a liquid microtarget
The Tin-Doped Droplet Laser Plasma Source – Meeting Roadmap Requirements
EXCITE, the MEDEA+ Extreme UV Consortium for Imaging Technology
EUV Lithography Programs at EUV Lithography Programs at Albany NanoTech NanoTech
Development Status of EUV Sources for Use in Alpha-, Beta- and High Volume Chip Manufacturing Tools
Xe- and Sn-fueled Z-pinch EUV source development aiming at HVM
2005 EUVL SYMPOSIUM, SAN DIEGO CA, U.S.A Asia Pacific Regional Update
Development of CO2 Laser Produced Xe Plasma EUV Light Source for Microlithography
Optimisation of Optical Design in Grazing Incidence Collector for EUV Lithography DPP Sources
Progress towards Sn DPP and LPP solutions: A source/collector perspective
The tin The tin-doped droplet laser plasma source – Satisfying EUV requirements
Comprehensive Integrated Simulation and Optimization of LPP for EUV Lithography Devices
EUV lithography related inspection and metrology research activities at MIRAI
Actinic inspection of EUV masks at the Advanced Light Source, Berkeley
Patterning Performance of Molecular Resists from the ASET-HINA
Microstepper vs. Interference EUV Lithography Effects on Resist Profiles
The integrated EUV Mask Process at the Advanced Mask Technology Centre (AMTC) in Dresden
Impact of Layout Dependent Flare on Printing in EUV Lithography
Resolution of EUV Photoresists Designed with Reduced Activation Energy
Fundamentals of the Reaction-Diffusion Process in Model EUV Photoresists
Lithographic characterization of low-order aberrations in the Berkeley MET tool
Scaling EUVL Beyond 0.25 NA with Applications to Patterning Contacts
Model of Ru surface oxidation for the lifetime scaling of EUVL projection optics mirror
Interaction of water vapor with clean and contaminated ruthenium surfaces
EUV Endurance Testing of Ruthenium-Capped Multilayer Mirrors
Lifetime improvement of projection mirror with Ru capping layer for EUVL by irradiation atmosphere
Investigation of the current resolution limits of advanced EUV resists
Lifetime estimation and improvement of capping layer on multi-layer mirror for lithography in EUVA
Recent advances in the cleaning of EUV substrates at SEMATECH
Concept Demonstration of Integrated Particle Defect Control of EUVL Masks
Improved Reticle Carrier Design Through Numerical Simulation
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Progress Toward Projection Optics Contamination & Condenser Erosion Test Protocols
Erosion of the condenser optics of the Engineering Test Stand
Estimations on Generation of High Energy Particles from LPP EUV Light Sources
Screening of oxidation resistant capping layers for EUV multilayers
Performance of Laser Produced Xe Plasma Light Source for EUV Lithography
High Power, Short Pulse and Cost Effective Laser Modules for LPP EUV Source
EUV reticles: particle-free handling and storage in the pellicle-less era
Commercial EUV Mask Blank Readiness for 45nm Half Pitch (HP) 2009 Manufacturing
Development of zero expansion silica glass for EUVL substrate
Advancing the Ion Beam Thin Film Planarization Process to Mitigate EUVL Mask Substrate Pit Defects
EUV Mask Pilot Line EUV Mask Pilot Line at Intel Corporation
At-wavelength EUV mask At-wavelength EUV mask inspection and imaging
Metrology and Removal of Nanoscale Particles from EUV Substrates
Accuracy evaluation of wavefront metrology for high N.A. EUV optics
Modelling Modelling of Chemically Amplified EUV Resist Processes
Layout compensation for EUV flare using contemporary EDA software
Recent Results on EUV Emission from Laser Produced Plasmas with Slab Targets Containing Sn
Modeling of LPP EUV Light Source at Japan MEXT Leading Project
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Detection Detection of buried defect using actinic darfkfield microscopy
Development of modified zero expansion Ti-doped silica glass for EUVL substrate
An Ellipsometric Picometer Sputtering-Rate Monitor for Exact EUV
Correlation between printability and visibility of defects in EUV mask blanks
Reduction of CD shift by optimizing incident angle and characteristics of absorber films
Efficient Simulation of Multilayer Defects on 2D and 3D EUV Masks
Masks Induced Imaging Artifacts in Extreme Ultraviolet Lithography
Mo/Si multilayers with arbitrary period thickness distributions
Defect Repair for Extreme Ultraviolet Lithography (EUVL) Mask Blanks
High-Speed EUV-Reflectometer with Compact Discharge EUV-Source Designed for Mask-Blank Inspection
A New Absorber Material Enables EUV Masks With Enhanced Etch Control and CD Uniformity
Commercial EUVL Mask Blanks: Supplier Infrastructure and Benchmarking
In situ ellipsometry investigation of Mo/Si multilayer growth for EUV mask blanc manufacturing
Novel instrumentation for in- and out of band metrology of EUVL sources
Recent Advances of the Visible-Light PDI for EUVL Aspheric Mirrors
Characterization of the Spatial Aspects of Line Edge Roughness
Techniques for directly measuring the absorbance of photoresists at EUV wavelengths
EXTREME ULTRA-VIOLET GENERATION PUMPED BY CO2 LASER-PRODUCED PLASMA
DEVELOPMENT OF A LASER PRODUCED-PLASMA SOURCE FOR EXTREME ULTRAVIOLET LITHOGRAPHY
Atomic Model and Equation of State for Hydrodynamic Simulation of Laser Plasma Sources
Radiation Characteristics of a Capillary Z-Pinch EUV Source*
Rotating Cryogenic Drum for Continuous Supply of Solid Xe Target
Dependence of EUV Emission Properties on Drive Laser Wavelength
Fabrication of porous tin(IV)oxide as a laser-plasma EUV source target
Detailed analysis of the optical scheme for the EXULITE LLP source
Integration and design optimization for the EXULITE LPP source
Ionization & Excitation Rate Coefficient Calculations for Plasma Emitting in EUV Range
Short Term Vacuum Outgassing Measurements by the Pressure Rise Method
PPT (10 mb) Sensor for Organic Contamination in Next Generation Lithography Tools
The optics contamination / lifetime program: an overview of supporting facilities
Evaluation of contamination on pinholes used in EUV wavefront metrology
Effect of EUV light scattering from the rough absorber and buffer side
Atomistic Investigation of the Si/Mo(110) Interface for EUV Reflectors
Evaluation of Property Change by the insertion of Ru Layer into Mo/Si Multilayer
Experimental study on basic properties of laser-produced plasma as an EUV source at GEKKO XII laser
Characterization of EUV emission from laser produced low-density Tin-oxidized plasmas
Laser heating of condensed Xe: EUV source efficiency considerations*
Performance Evaluation on Discharge & Laser based EUV Sources using Z* 2-D Radiation MHD Modelling
Modeling of Xenon EUV Emission Spectra and MHD Plasma Parameters for a DPF Light Source
EXCITE: A MEDEA+ Extreme UV Consortium for Imaging Technology
EUV microexposure capabilities at the ALS using the 0.3-NA optic
Evaluation of low expansion electrostatic chuck materials for EUV Lithography.
Particle-Induced Distortion in EUVL Reticles during Exposure Chucking
EUV lithography applied to the coloration of LiF for photonics
Fabrication and alignment of 10X-Schwarzschild optics for F2X experiments
Second International Symposium Antwerp, 30 September-2 October 2003
Laser-Produced-Plasma Light Source Development for EUV Lithography at EUVA
High Power Gas Discharge and Laser Produced Plasma Sources for EUV Lithography
High Power Short Pulse and Cost Effective Laser Modules for Laser Produced Plasma (LPP) EUV Source
Advances in the Ion Beam Thin Film Planarization Process for Mitigating EUVL Mask Defects
Technology Steps to the Pilot Production of EUV Mask Blanks in 2005
Resist Characteristics in EUVL -Mitigation of hydrocarbon outgassing species & LER in CA resist
Effect of Polymer Molecular Weight and Resist Sensitivity on LER and AFM Morphology of EUV Resists
Throughput Model Consideration and Impact of Throughput Improvement Request on Exposure Tool
Engineering Tests Stand (ETS) Updates: Lithographic and Tool Learning
Advances in EUV Lithography Development for Sub-50nm DRAM Nodes
The Development of Coating Technology for the Production of Mask Blanks for EUVL
Development of high conversion efficiency high power EUV sources for lithography
Japan MEXT Leading Project for Laser-Produced Plasma EUV Light Source Development
Secondary-Plasma-Based Debris Mitigation for Next Generation EUVL Sources
Studies on x-ray conversion efficiency in Xe cryogenic targets
EUV Symposium 2003 The EUV optics development program at Carl Zeiss SMT AG
EUV projection optics and active mirror development at SAGEM
Visible Light Interferometry and Alignment of the MET Projection Optics
Smoothing of the substrate surface by Mo/Si multilayer coating deposited by ion beam sputtering
The Experimental EUV Interferometer with Several Measurement Methods
Development of EUV-Scatterometry for CD Characterization of Masks
Second International Symposium Antwerp, 30 September-2 October 2003
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Use of Molecular Oxygen to Reduce EUV-induced Carbon Contamination of Optics
First Environmental Data from the Engineering Test Stand (ETS)
Deformation of EUVL Mask due to Multilayer and Absorber-Pattern Stress
Multilayer mirror coatings for high numerical aperture extreme-ultraviolet lithography systems
Fabrication of ETS Set II Optics: Results and Future Development
Construction of the Projection Optics Box for the Engineering Test Stand
EUV ALIGNMENT AND TESTING OF A 4-MIRROR RING-FIELD EUV OPTICAL SYSTEM
Evaluation of resist performance utilizing EUV microfield exposure tool
Rigorous EUV Imaging Simulations and their Assessment on Overall System Performance
EUV Micro-Exposure Tool (MET) for Near-Term Development Using a Hight NA Projection System
System Integration and Performance of the EUV Engineering Test Stand
E-D characteristics and aberration sensitivity of the Micro-Exposure Tool (MET)
Characterization of EUVL Mask Defects by EUV Far-Field Scattering Patterns
A Recent Look into Finishing Results of NZTE Mask Blank Substrates
Inspection of EUVL Mask Blanks Using Commercial Wafer Inspection Tools
Alignment of a ring-field EUV projection optics system by visible-light interferometry
Integration of EUV-Thickness Resist Processes into MPU Manufacturing Flows
X-ray and EUV emission induced by variable pulsewidth irradiation of Ar and Kr clusters and droplets
Development of a High Average Power Extreme-Ultraviolet Electric Capillary Discharge Source
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EUV generation from rare gas clusters excited by ultrashort KrF laser
Progress in Mo/Si multilayer coating technology for EUVL optics
PRODUCTION and PROPERTIES of ULEÒ GLASS with REGARDS to EUV MASKS
Coherence, Entendue, and the Design of Condenser Optics for EUV Lithography
Increasing the Reflectivity of Extreme Ultraviolet Multilayred Mirrors